IP Library › Assignment 059879/0406
Patent Assignment
Reel/Frame 059879/0406

Assignment of Assignor's Interest

Recorded: 2022-05-10 Pages: 10
Assignors
SINGH, HARDEEP
Executed: 2022-05-03
SHARMA, RACHIT
Executed: 2022-05-09
HANNA, TIMOTHY GLEN
Executed: 2022-04-13
KULKARNI, DEVDATTA P.
Executed: 2022-05-02
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Cooling Mass and Spring Element for Low Insertion Force Hot Swappable Electronic Component Interface
Application: 17/697,877 →
Publication: US 2022/0210952
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 17, 2025
From: INTEL CORPORATION
To: SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
Reel/Frame 072792/0266 →