Patent Assignment
Reel/Frame 059896/0756
Assignment of Assignor's Interest
Recorded: 2022-05-13
Pages: 10
Assignors
WU, JIA-RONG
Executed: 2022-05-10
CHENG, CHI-HSUAN
Executed: 2022-05-10
HUANG, RAI-MIN
Executed: 2022-05-10
HSU, PO-KAI
Executed: 2022-05-10
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Semiconductor Device and Method for Fabricating the Same