Patent Assignment
Reel/Frame 059942/0843
Assignment of Assignor's Interest
Recorded: 2022-05-18
Pages: 3
Assignor
GRIVNA, GORDON M.
Executed: 2019-08-01
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Process of Forming an Electronic Device Including a Polymer Support Layer
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 4, 2022
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; ON SEMICONDUCTOR CONNECTIVITY SOLUTIONS, INC.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 061071/0525 →
Release of Security Interest in Patents, Recorded at Reel 061071, Frame 052
Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, AS GRANTOR; ON SEMICONDUCTOR CONNECTIVITY SOLUTIONS, INC., AS GRANTOR
Reel/Frame 064067/0654 →