Patent Assignment
Reel/Frame 059958/0632
Assignment of Assignor's Interest
Recorded: 2022-05-19
Pages: 2
Assignors
ACAR, MUSTAFA
Executed: 2021-06-21
FREIDL, PHILIPP FRANZ
Executed: 2021-06-21
KAMPHUIS, ANTONIUS HENDRIKUS JOSEF
Executed: 2021-06-21
BERGMAN, JAN WILLEM
Executed: 2021-06-21
MANDAMPARAMBIL, RAJESH
Executed: 2021-06-21
Assignee
NXP B.V.
HIGH TECH CAMPUS 60, EINDHOVEN, 5656-AG, NETHERLANDS
Covered Property
(1)
Grounding Assembly for a Semiconductor Device