Grounding assembly for a semiconductor device
A semiconductor device may include an antenna array and a grounding assembly configured to at least partially electrically shield the antenna array. The grounding assembly may include a first grounding layer comprising a first plurality of openings and a second grounding layer comprising a second plurality of openings. The second grounding layer may at least partially occlude the first plurality of openings of the first grounding layer when viewed from above the antenna array.
1. A semiconductor device comprising:
an antenna array; and
a grounding assembly configured to at least partially electrically shield the antenna array, wherein the grounding assembly comprises:
a first grounding layer comprising a first plurality of openings; and
a second grounding layer comprising a second plurality of openings, wherein the second grounding layer at least partially occludes the first plurality of openings of the first grounding layer when viewed from above the antenna array, and wherein the first plurality of openings each have a different size and/or shape relative to the second plurality of openings.
2. The semiconductor device of claim 1 , wherein the first grounding layer comprises solid walls surrounding the first plurality of openings, and the second grounding layer comprises solid walls surrounding the second plurality of openings, wherein the solid walls of the second grounding layer at least partially block the first plurality of openings.
3. The semiconductor device of claim 1 , wherein the first grounding layer is electrically coupled to the second grounding layer.
4. The semiconductor device of claim 1 , wherein at least one of the first grounding layer and the second grounding layer comprise a mesh.
5. The semiconductor device of claim 1 , wherein the first grounding layer and the second grounding layer are arranged in a stack.
6. The semiconductor device of claim 1 , wherein the first plurality of openings are offset with respect to the second plurality of openings when viewed from above the antenna array.
7. The semiconductor device of claim 1 , wherein the second grounding layer completely occludes the first plurality of openings when viewed from above the antenna array.
8. The semiconductor device of claim 1 , further comprising at least one conductor extending from the antenna array through the first grounding layer and the second grounding layer, wherein the at least one conductor is electrically isolated from the grounding assembly.
9. The semiconductor device of claim 1 , wherein the grounding assembly further comprises:
a third grounding layer comprising a third plurality of openings, wherein the third grounding layer at least partially occludes the second plurality of openings of the second grounding layer when viewed from above the antenna array.
10. The semiconductor device of claim 9 , wherein the third plurality of openings are offset with respect to the second plurality of openings and the first plurality of openings when viewed from above the antenna array.
11. The semiconductor device of claim 1 , further comprising an integrated circuit package, wherein the grounding assembly is provided in the integrated circuit package and the antenna array is mounted to, or provided in, the integrated circuit package.
12. The semiconductor device of claim 1 , wherein the antenna array is a patch antenna array.
13. A semiconductor device comprising:
an antenna array; and
a grounding assembly configured to at least partially electrically shield the antenna array, wherein the grounding assembly comprises:
a first grounding layer comprising a first plurality of openings; and
a second grounding layer comprising a second plurality of openings, wherein the first grounding layer at least partially blocks the second plurality of openings of the second grounding layer when viewed from a direction parallel to a surface normal of the antenna array, and wherein the first plurality of openings are offset with respect to the second plurality of openings when viewed from a direction parallel to a surface normal of the antenna array.
14. The semiconductor device of claim 13 , further comprising an integrated circuit package, wherein the grounding assembly is provided in the integrated circuit package and the antenna array is mounted to, or provided in, the integrated circuit package.
15. The semiconductor device of claim 13 , further comprising providing a third grounding layer comprising a third plurality of openings, wherein the third grounding layer at least partially blocks the second plurality of openings when viewed from a direction parallel to a surface normal of the antenna array.
16. A semiconductor device comprising:
an antenna array;
a grounding assembly configured to at least partially electrically shield the antenna array, wherein the grounding assembly comprises:
a first grounding layer comprising a first plurality of openings; and
a second grounding layer comprising a second plurality of openings, wherein the second grounding layer at least partially occludes the first plurality of openings of the first grounding layer when viewed from above the antenna array, and
at least one conductor extending from the antenna array through the first grounding layer and the second grounding layer, wherein the at least one conductor is electrically isolated from the grounding assembly.