Patent Assignment
Reel/Frame 059987/0627
Assignment of Assignor's Interest
Recorded: 2022-05-12
Pages: 3
Assignor
KIM, YOUNGSUK
Executed: 2022-04-27
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU,, TOKYO, 143-8580, JAPAN
Covered Property
(1)
Processing Method of Wafer