Patent Assignment
Reel/Frame 059993/0065
Assignment of Assignor's Interest
Recorded: 2022-05-23
Pages: 4
Assignors
YANG, SU-CHUN
Executed: 2022-05-06
TWU, JIH-CHURNG
Executed: 2022-05-09
WU, JIUNG
Executed: 2022-05-12
TUNG, CHIH-HANG
Executed: 2022-05-08
YU, CHEN-HUA
Executed: 2022-05-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Die Stacking Structure, Semiconductor Package and Formation Method of the Die Stacking Structure