Die stacking structure, semiconductor package and formation method of the die stacking structure
A die stacking structure, a semiconductor package and a method for forming the die stacking structure are provided. The die stacking structure includes a first device die; second device dies, bonded onto the first device die, and arranged side-by-side; and a stack of dielectric layers, extending in between the second device dies, and laterally enclosing each of the second device dies. The dielectric layers are respectively formed of a spin-on-glass (SOG) or a polymer, and a lower one of the dielectric layers has a thickness greater than a thickness of another one of the dielectric layers at a higher level.
1. A die stacking structure, comprising:
a first device die;
second device dies, bonded onto the first device die, and arranged side-by-side; and
a stack of dielectric layers, extending in between the second device dies, and laterally enclosing each of the second device dies, wherein the dielectric layers are respectively formed of a spin-on-glass (SOG) or a polymer, and a lower one of the dielectric layers has a thickness greater than a thickness of another one of the dielectric layers at a higher level,
wherein a topmost one of the dielectric layers has a substantially flat top surface, and others of the dielectric layers each have a top surface concave toward the first device die.
2. The die stacking structure according to claim 1 , wherein a mechanical strength of a lower one of the dielectric layers is greater than a mechanical strength of another one of the dielectric layers at a higher level.
3. The die stacking structure according to claim 1 , wherein a carbon content in a lower one of the dielectric layers is greater than a carbon content in another one of the dielectric layers at a higher level.
4. The die stacking structure according to claim 1 , wherein the top surface of the topmost one of the dielectric layers is substantially coplanar with top surfaces of the second device dies.
5. The die stacking structure according to claim 1 , wherein a bottommost one of the dielectric layers has a bottom surface extending along a top surface of the first device die, and others of the dielectric layers each have a bottom surface concave toward the first device die.
6. The die stacking structure according to claim 1 , wherein a thickness of a bottommost one of the dielectric layers gradually decreases from sidewalls of the second device dies, and a thickness of a topmost one of the dielectric layers gradually increases from the sidewalls of the second devices.
7. The die stacking structure according to claim 1 , further comprising:
at least one adhesion layer, separating the dielectric layers from the first and second device dies.
8. The die stacking structure according to claim 7 , wherein the at least one adhesion layer comprises a first adhesion layer and a second adhesion layer formed of different materials, and the second adhesion layer extends in between the first adhesion layer and the dielectric layers.
9. The die stacking structure according to claim 1 , further comprising:
a protection layer, extending along a topmost surface of the dielectric layers and top surfaces of the second device dies.
10. A semiconductor package, comprising:
a die stacking structure, comprising:
a first device die;
second device dies, bonded to the first device die and arranged side-by-side; and
a stack of dielectric layers, extending in between the second device dies, and laterally enclosing each of the second device dies, wherein the dielectric layers are respectively formed of a spin-on-glass (SOG) or a polymer, and one of the dielectric layers has a thickness greater than a thickness of another one of the dielectric layers more distant from the first device die; and
a package component, electrically connected to the die stacking structure from above or below the die stacking structure,
wherein a topmost one of the dielectric layers has a substantially flat top surface, and others of the dielectric layers each have a top surface concave toward the first device die.
11. The semiconductor package according to claim 10 , wherein the package component is an interposer comprising through substrate vias for providing vertical conduction paths, and the die stacking structure is bonded to a first side of the interposer.
12. The semiconductor package according to claim 11 , wherein the interposer is bonded to a package substrate by a second side facing away from the first side.
13. The semiconductor package according to claim 10 , wherein the die stacking structure is laterally encapsulated by an encapsulant, and a redistribution structure is formed along a first side of an encapsulated structure comprising the die stacking structure and the encapsulant.
14. The semiconductor package according to claim 13 , further comprising a semiconductor package bonded to a second side of the encapsulated structure facing away from the redistribution structure.
15. The semiconductor package according to claim 14 , wherein through encapsulant vias extend through the encapsulant to provide vertical conductive paths in the encapsulant.
16. A method for forming a die stacking structure, comprising:
providing a device wafer;
bonding device dies onto the device wafer;
performing a first solution process using a first spin-on-glass (SOG) or a first polymer, to form a first dielectric layer laterally enclosing each of the device dies;
performing a second solution process using a second SOG or a second polymer, to form a second dielectric layer on the first dielectric layer;
performing a third solution process using a third SOG or a third polymer, to form a third dielectric layer on the second dielectric layer, wherein;
performing a planarization process on the third dielectric layer, such that the third dielectric layer has a substantially flat top surface, whereas the first and second dielectric layers respectively have a top surface concave toward the device wafer; and
performing a singulation process, to cut through the device wafer and the first through third dielectric layers.
17. The method for forming the die stacking structure according to claim 16 , wherein the first through third solution processes respectively comprise a spin coating process, an inkjet printing process or a dispensing process.
18. The method for forming the die stacking structure according to claim 16 , further comprising:
forming at least one adhesion layer conformally covering the device wafer and the device dies before performing the first solution process.
19. The method for forming the die stacking structure according to claim 16 , further comprising:
forming a protection layer to cover the first through third dielectric layers and the device dies before performing the singulation process.
20. The method for forming the die stacking structure according to claim 16 , wherein a viscosity of the second SOG/polymer is greater than a viscosity of the first SOG/polymer, and a viscosity of the third SOG/polymer is greater than the viscosity of the second SOG/polymer.