Patent Assignment
Reel/Frame 060002/0733
Assignment of Assignor's Interest
Recorded: 2022-05-24
Pages: 3
Assignors
CHEN, CHUNG-LEI
Executed: 2022-04-15
CHENG, ANHAO
Executed: 2022-04-12
KANG, MENG-I
Executed: 2022-04-17
LIN, YEN-LIANG
Executed: 2022-04-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Devices and Methods of Manufacturing Thereof