Patent Assignment
Reel/Frame 060027/0235
Assignment of Assignor's Interest
Recorded: 2022-05-26
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN ROAD 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Packages and Methods of Manufacturing Thereof