Patent Assignment
Reel/Frame 060059/0231
Assignment of Assignor's Interest
Recorded: 2022-05-31
Pages: 7
Assignors
LEE, JU HYUNG
Executed: 2022-05-03
KWON, DONG UK
Executed: 2022-05-03
KIM, SUN CHUL
Executed: 2022-05-03
KIM, YONG HYUN
Executed: 2022-05-03
LEE, MIN JAE
Executed: 2022-05-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Fabricating a Semiconductor Package Including an Interposer
Application:
17/804,742 →
Publication:
US 2023/0081723