Method of fabricating a semiconductor package including an interposer
A method of fabricating a semiconductor package includes disposing a preliminary semiconductor package on a stage, the preliminary semiconductor package including a substrate to which a pad part is attached, an interposer disposed on the substrate, and a semiconductor chip disposed between the substrate and the interposer. A bonding tool is disposed on the interposer. The bonding tool includes a first region and a second region outside of the first region. The second region of the bonding tool corresponds to the pad part. The interposer and the substrate are bonded to each other.
1 . A method of fabricating a semiconductor package, comprising:
disposing a preliminary semiconductor package on a stage, the preliminary semiconductor package including a substrate to which a pad part is attached, an interposer disposed on the substrate, and a semiconductor chip disposed between the substrate and the interposer;
disposing a bonding tool on the interposer, the bonding tool including a first region and a second region outside of the first region, the first region and the second region being adjacent regions of a single flat plate structure; and
disposing the second region of the bonding tool so as to correspond to the pad part and bonding the interposer and the substrate to each other;
wherein the pad part includes a pair of first pad parts facing each other in a first direction and a pair of second pad parts facing each other in a second direction, and
wherein the pair of first pad parts have a height different from that of the pair of a second pad parts.
2 . The method of fabricating a semiconductor package of claim 1 , wherein the bonding tool further includes a protrusion part formed in the second region and protruding from the bonding tool, and
wherein the protrusion part is in contact with the pad part.
3 . The method of fabricating a semiconductor package of claim 2 , wherein a thickness of the protrusion part is the same as a distance between a surface of the substrate and a surface of the bonding tool.
4 . The method of fabricating a semiconductor package of claim 2 , wherein the bonding tool extends in each of the first direction and the second direction crossing the first direction,
wherein the protrusion part includes a pair of first protrusion parts facing each other in the first direction and a pair of second protrusion parts facing each other in the second direction, and
wherein the pair of first protrusion parts have the same height as each other, and the pair of second protrusion parts have the same height as each other.
5 . The method of fabricating a semiconductor package of claim 4 , wherein with respect to the first direction, the pair of first protrusion parts are spaced apart from an outer peripheral surface of the bonding tool.
6 . The method of fabricating a semiconductor package of claim 4 ,
wherein the pair of first pad parts correspond to the pair of first protrusion parts, and the pair of second pad parts correspond to the pair of second protrusion parts.
7 . The method of fabricating a semiconductor package of claim 1 , wherein the bonding tool further includes a plurality of holes penetrating through the bonding tool, and
wherein the bonding tool adsorbs the interposer through the plurality of holes.
8 . The method of fabricating a semiconductor package of claim 1 , wherein a recess exposing at least a portion of an inner surface of the substrate is formed at an edge of the substrate, and
wherein the pad part is disposed within the recess such that a top surface of the pad part is level with a top surface of the substrate.
9 . The method of fabricating a semiconductor package of claim 1 , wherein the pad part includes at least one bent part.
10 . The method of fabricating a semiconductor package of claim 1 , wherein the pad part is formed to a thickness of 200 μm or less.
11 . The method of fabricating a semiconductor package of claim 1 , wherein the pad part includes a metal material.
12 . A method of fabricating a semiconductor package, comprising:
disposing a preliminary semiconductor package on a stage, the preliminary semiconductor package including a substrate to which a pad part is attached, an interposer disposed on the substrate, and a semiconductor chip disposed between the substrate and the interposer;
disposing a bonding tool on the interposer, the bonding tool including a first region and a second region outside the first region; and
disposing the second region of the bonding tool so as to correspond to the pad part and bonding the interposer and the substrate to each other,
wherein the bonding tool further includes a protrusion part formed in the second region and protruding from the bonding tool,
wherein the protrusion part is in contact with the pad part,
wherein the bonding tool extends in each of a first direction and a second direction crossing the first direction,
wherein the protrusion part includes a pair of first protrusion parts facing each other in the first direction and a part of second protrusion parts facing each other in the second direction,
wherein the pair of the first protrusion parts have the same height as each other, and the pair of second protrusion parts have the same height as each other,
wherein the pad part includes a pair of first pad parts facing each other in the first direction and a part of second pad parts facing each other in the second direction,
wherein the pair of first pad parts correspond to the pair of first protrusion parts, and the pair of second pad parts correspond to the pair of second protrusion parts, and
wherein the pair of first pad parts have a height different from that of the pair of a second pad parts.
13 . A method of fabricating a semiconductor package, comprising:
disposing a preliminary semiconductor package on a stage, the preliminary semiconductor package including a substrate having a recess formed therein, an interposer disposed on the substrate, and a semiconductor chip disposed between the substrate and the interposer;
disposing a bonding tool on the interposer, the bonding tool including a first region and a second region outside of the first region, the first region and the second region being adjacent regions of a single flat plate structure; and
disposing the second region of the bonding tool so as to correspond to the recess and bonding the interposer and the substrate to each other;
wherein the substrate includes a pad part and the pad part includes a pair of first pad parts facing each other in a first direction and a pair of second pad parts facing each other in a second direction, and
wherein the pair of first pad parts have a height different from that of the pair of a second pad parts.
14 . The method of fabricating a semiconductor package of claim 13 , wherein the bonding tool further includes a protrusion part protruding from the bonding tool and disposed to at least partially surround the first region.
15 . The method of fabricating a semiconductor package of claim 13 , wherein the bonding tool further includes a protrusion part formed in the second region and protruding from the bonding tool, and
wherein the pad part is formed within the recess such that a top surface of the pad part is level with a top surface of the substrate.
16 . The method of fabricating a semiconductor package of claim 15 , wherein the bonding tool extends in each of the first direction and the second direction crossing the first direction,
wherein the protrusion part includes a pair of first protrusion parts facing each other in the first direction and a pair of second protrusion parts facing each other in the second direction, and
wherein the pair of first protrusion parts have the same height as each other, and the pair of second protrusion parts have the same height as each other.
17 . The method of fabricating a semiconductor package of claim 16 , wherein with respect to the first direction, the pair of first protrusion parts are spaced apart from an outer peripheral surface of the bonding tool.