Patent Assignment
Reel/Frame 060061/0700
Assignment of Assignor's Interest
Recorded: 2022-05-31
Pages: 5
Assignor
ISHIBASHI, TOMOATSU
Executed: 2022-04-21
Assignee
EBARA CORPORATION
11-1, HANEDA ASAHI-CHO, OTA-KU, TOKYO, 144-8510, JAPAN
Covered Property
(1)
Substrate Cleaning Apparatus, Polishing Apparatus, Buffing Apparatus, Substrate Cleaning Method, Substrate Processing Apparatus, and Machine Learning Apparatus