Patent Assignment
Reel/Frame 060067/0526
Assignment of Assignor's Interest
Recorded: 2022-06-01
Pages: 11
Assignors
LO, TING-YA
Executed: 2020-06-02
TENG, CHI-LIN
Executed: 2020-06-04
CHEN, HAI-CHING
Executed: 2020-06-04
HUANG, HSIN-YEN
Executed: 2020-06-02
SHUE, SHAU-LIN
Executed: 2020-06-04
LEE, SHAO-KUAN
Executed: 2020-06-02
LEE, CHENG-CHIN
Executed: 2020-06-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Capping Layer Overlying Dielectric Structure to Increase Reliability