Patent Assignment
Reel/Frame 060068/0136
Assignment of Assignor's Interest
Recorded: 2022-05-13
Pages: 3
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip and Semiconductor Package Including the Same