Patent Assignment
Reel/Frame 060086/0121
Assignment of Assignor's Interest
Recorded: 2022-06-02
Pages: 6
Assignors
LEE, GUNHYUCK
Executed: 2022-06-02
LEE, HEESOO
Executed: 2022-06-02
SON, SANGHYUN
Executed: 2022-06-02
HWANG, BOKYEONG
Executed: 2022-06-02
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Disposing Electrical Components Over Side Surfaces of Interconnect Substrate