Patent Assignment
Reel/Frame 060090/0325
Assignment of Assignor's Interest
Recorded: 2022-06-02
Pages: 3
Assignee
KIOXIA CORPORATION
1-21, SHIBAURA 3-CHOME, MINATO-KU, TOKYO, 108-0023, JAPAN
Covered Property
(1)
Wiring Formation Method, Method for Manufacturing Semiconductor Device, and Semiconductor Device