IP Library › Assignment 060108/0888
Patent Assignment
Reel/Frame 060108/0888

Assignment of Assignor's Interest

Recorded: 2022-06-06 Pages: 5
Assignors
CHANG, PEI SHAN
Executed: 2022-04-26
HUANG, CHUN-HSIEN
Executed: 2022-04-26
HSU, PENG-HAO
Executed: 2022-04-26
LEE, KEVIN
Executed: 2022-04-26
CHANG, SHU-LAN
Executed: 2022-06-03
CHENG, YA-YI
Executed: 2022-04-29
CHEN, CHING-YI
Executed: 2022-05-13
LIN, WEI-JUNG
Executed: 2022-04-26
CHANG, CHIH-WEI
Executed: 2022-04-29
CHAO, YI-HSIANG
Executed: 2022-05-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Contact Features of Semiconductor Device and Method of Forming Same
Application: 17/663,315 →
Publication: US 2023/0260836
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Omission 11TH Assignor's Name Previously Recorded at Reel: 060108 Frame: 0888. Assignor(S) Hereby Confirms the Assignment . Aug 5, 2022
From: CHANG, PEI SHAN; HUANG, CHUN-HSIEN; HSU, PENG-HAO; LEE, KEVIN
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 061085/0397 →