IP Library › Assignment 061085/0397
Patent Assignment
Reel/Frame 061085/0397

Corrective Assignment to Correct the Omission 11TH Assignor's Name Previously Recorded at Reel: 060108 Frame: 0888. Assignor(S) Hereby Confirms the Assignment .

Recorded: 2022-08-05 Pages: 9
Assignors
CHANG, PEI SHAN
Executed: 2022-06-19
HUANG, CHUN-HSIEN
Executed: 2022-06-19
HSU, PENG-HAO
Executed: 2022-06-19
LEE, KEVIN
Executed: 2022-06-19
CHANG, SHU-LAN
Executed: 2022-07-02
CHENG, YA-YI
Executed: 2022-07-18
CHEN, CHING-YI
Executed: 2022-07-25
LIN, WEI-JUNG
Executed: 2022-07-25
CHANG, CHIH-WEI
Executed: 2022-08-04
CHAO, YI-HSIANG
Executed: 2022-08-04
TSAI, MING-HSING
Executed: 2022-08-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Contact Features of Semiconductor Device and Method of Forming Same
Application: 17/663,315 →
Publication: US 2023/0260836
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 6, 2022
From: CHANG, PEI SHAN; HUANG, CHUN-HSIEN; HSU, PENG-HAO; LEE, KEVIN
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 060108/0888 →