Patent Assignment
Reel/Frame 060130/0842
Assignment of Assignor's Interest
Recorded: 2022-06-08
Pages: 5
Assignor
KOSHIMIZU, KAZUTOSHI
Executed: 2022-04-25
Assignee
FUJIKURA LTD.
5-1, KIBA 1-CHOME, KOTO-KU, TOKYO, 135-8512, JAPAN
Covered Property
(1)
Method for Manufacturing Wiring Board, Wiring Board, Method for Manufacturing Molded Object, Molded Object