Granted Patent B2

US 12,284,767 · App. 17/779,898 · Granted Apr 22, 2025

Inventor: Kazutoshi Koshimizu (Chiba, JP)

Assignee: Fujikura Ltd.

H05K3/048H05K1/0353H05K3/101H05K3/1258H05K2201/09118H05K2203/0574H05K2203/0582

Abstract

Claims (45)

1. A method for manufacturing a wiring board, comprising:

disposing a first resist material on a substrate;

forming a first resist layer by curing the first resist material;

forming a resin layer on a release film;

forming a conductor portion on the resin layer;

covering the conductor portion by disposing a second resist material on the resin layer;

forming a second resist layer by curing the second resist material;

bringing the first resist layer into contact with the second resist layer, and thereafter bonding the first resist layer and the second resist layer by thermocompression bonding; and

releasing the release film from the resin layer, wherein

the conductor portion comprises:

a first conductor portion; and

a second conductor portion,

the wiring board comprises an insulation layer interposed between the first and second conductor portions, and

the forming of the conductor portion on the resin layer comprises:

forming the second conductor portion on the resin layer;

forming the insulation layer on at least a part of the second conductor portion; and

forming the first conductor portion on both of the resin layer and the insulation layer.

2. The method according to claim 1 , wherein

the first resist layer has a breaking elongation of 50% or more at 100° C., and

the second resist layer has a breaking elongation of 50% or more at 100° C.

3. The method according to claim 1 , wherein a composition of the first resist material is same as a composition of the second resist material.

4. The method according to claim 1 , wherein the substrate is composed of acrylonitrile-butadiene-styrene (ABS) resin or polycarbonate.

5. A method for manufacturing a molded object, comprising:

manufacturing a wiring board using the method according to claim 1 ; and

forming a molded portion into a three-dimensional shape by molding at least a part of the wiring board, wherein

at least a part of the conductor portion is disposed in the molded portion.

6. A method for manufacturing a molded object, comprising:

manufacturing a wiring board using the method according to claim 1 ; and

before disposing the first resist material on the substrate, forming a molded portion into a three-dimensional shape by molding at least a part of the substrate, wherein

at least a part of the conductor portion is disposed on the molded portion through the first and second resist layers.

7. A method for manufacturing a wiring board, comprising:

disposing a first resist material on a substrate;

forming a resin layer on a release film;

forming a conductor portion on the resin layer;

covering the conductor portion by disposing a second resist material on the resin layer;

bringing the first resist material into contact with the second resist material, and thereafter forming a first resist layer and a second resist layer by respectively curing the first resist material and the second resist material; and

releasing the release film from the resin layer, wherein

the conductor portion comprises:

a first conductor portion; and

a second conductor portion,

the wiring board comprises an insulation layer interposed between the first and second conductor portions, and

the forming of the conductor portion on the resin layer comprises:

forming the second conductor portion on the resin layer;

forming the insulation layer on at least a part of the second conductor portion; and

forming the first conductor portion on both of the resin layer and the insulation layer.

Assignments (1)

Priority Claims (1)

Continuity (1)

References Cited (19)