Patent Assignment
Reel/Frame 060152/0514
Assignment of Assignor's Interest
Recorded: 2022-06-09
Pages: 3
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Multi-Chip Modules Formed Using Wafer-Level Processing of a Reconstituted Wafer
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jun 9, 2022
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 060329/0199 →
Security Interest
May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Change of Name
Sep 14, 2023
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 064910/0526 →