IP Library Assignment 064910/0526
Patent Assignment
Reel/Frame 064910/0526

Change of Name

Recorded: 2023-09-14 Pages: 4
Assignor
INVENSAS LLC
Executed: 2022-08-15
Assignee
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Multi-Chip Modules Formed Using Wafer-Level Processing of a Reconstituted Wafer
Application: 17/835,851 →
Publication: US 2022/0375864
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 9, 2022
From: WANG, LIANG; KATKAR, RAJESH
To: INVENSAS CORPORATION
Reel/Frame 060152/0514 →
Change of Name Jun 9, 2022
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 060329/0199 →
Security Interest May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →