IP Library › Assignment 060153/0133
Patent Assignment
Reel/Frame 060153/0133

Assignment of Assignor's Interest

Recorded: 2022-06-09 Pages: 4
Assignors
YAO, HSUAN-HSIAO
Executed: 2022-05-17
PO-KAI, HSIAO
Executed: 2022-06-09
LIN, FAN-CHENG
Executed: 2022-05-09
HUANG, TSAI-YU
Executed: 2022-05-09
CHANG, HUICHENG
Executed: 2022-05-12
YEO, YEE-CHIA
Executed: 2022-05-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Semiconductor Device and Method of Forming Same
Application: 17/751,367 →
Publication: US 2023/0378261
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 28, 2022
From: YAO, HSUAN-HSIAO; HSIAO, PO-KAI; LIN, FAN-CHENG; HUANG, TSAI-YU
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 060332/0001 →