Patent Assignment
Reel/Frame 060332/0001
Assignment of Assignor's Interest
Recorded: 2022-06-28
Pages: 4
Assignors
YAO, HSUAN-HSIAO
Executed: 2022-06-21
HSIAO, PO-KAI
Executed: 2022-06-21
LIN, FAN-CHENG
Executed: 2022-06-24
HUANG, TSAI-YU
Executed: 2022-06-21
CHANG, HUICHENG
Executed: 2022-06-21
YEO, YEE-CHIA
Executed: 2022-06-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Method of Forming Same
Application:
17/751,367 →
Publication:
US 2023/0378261
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.