Patent Assignment
Reel/Frame 060156/0586
Assignment of Assignor's Interest
Recorded: 2022-06-10
Pages: 10
Assignors
LIN, DA-JUN
Executed: 2022-06-07
TSAI, FU-YU
Executed: 2022-06-07
TSAI, BIN-SIANG
Executed: 2022-06-07
CHIU, CHUNG-YI
Executed: 2022-06-07
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Method for Forming Ohmic Contacts on Compound Semiconductor Devices