Assignment of Assignor's Interest

Recorded: 2022-06-10 Pages: 3

Assignors

KITAMURA, HIROSHI

Executed: 2022-06-10

NAMIKI, AKIHISA

Executed: 2022-06-10

MASUDA, TSUYOSHI

Executed: 2022-06-10

MATSUMURA, YOSHIYUKI

Executed: 2022-06-10

Assignee

CMC MATERIALS KK

1287-19 KITAKOYAMA, GEINO-CHO, TSU-SHI, MIE, 514-2213, JAPAN

Covered Property (1)

Chemical-Mechanical Polishing Composition and Chemical-Mechanical Polishing Method Using the Same

Application: 17/784,228 →

Publication: US 2024/0263039

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.