IP Library › Assignment 065686/0902
Patent Assignment
Reel/Frame 065686/0902

Merger

Recorded: 2023-11-28 Pages: 10
Assignor
CMC MATERIALS KK
Executed: 2023-08-07
Assignee
ENTEGRIS JAPAN CO., LTD.
1-4-28 MITA, MINATO-KU, TOKYO, 108-0073, JAPAN
Covered Properties (5)
Slurry Composition and Method of Substrate Polishing
Patent: 9,528,031 →
Application: 14/784,527 →
Publication: US 2016/0068713
Slurry Composition and Method for Polishing Substrate
Patent: 9,914,853 →
Application: 15/126,543 →
Publication: US 2017/0037278
Chemical-Mechanical Polishing Composition, Rinse Composition, Chemical-Mechanical Polishing Method, and Rinsing Method
Application: 17/260,106 →
Publication: US 2021/0284868
Chemical-Mechanical Polishing Composition, Rinse Composition, Chemical-Mechanical Polishing Method, and Rinsing Method
Application: 17/620,181 →
Publication: US 2022/0372329
Chemical-Mechanical Polishing Composition and Chemical-Mechanical Polishing Method Using the Same
Application: 17/784,228 →
Publication: US 2024/0263039
Related Assignments (9)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 14, 2015
From: KITAMURA, HIROSHI; MASUDA, TSUYOSHI; MATSUMURA, YOSHIYUKI
To: NIHON CABOT MICROELECTRONICS K.K.
Reel/Frame 036793/0984 →
Assignment of Assignor's Interest Sep 15, 2016
From: KITAMURA, HIROSHI; MASUDA, TSUYOSHI; MATSUMURA, YOSHIYUKI
To: NIHON CABOT MICROELECTRONICS K.K.
Reel/Frame 039760/0222 →
Change of Name Jan 13, 2021
From: NIHON CABOT MICROELECTRONICS K.K.
To: CMC MATERIALS KK
Reel/Frame 054979/0924 →
Assignment of Assignor's Interest Jan 13, 2021
From: MASUDA, TSUYOSHI; KITAMURA, HIROSHI; MATSUMURA, YOSHIYUKI; NAMIKI, AKIHISA
To: NIHON CABOT MICROELECTRONICS K.K.
Reel/Frame 054908/0197 →
Assignment of Assignor's Interest Jan 5, 2022
From: KITAMURA, HIROSHI; MASUDA, TSUYOSHI; MATSUMURA, YOSHIYUKI; NAMIKI, AKIHISA
To: CMC MATERIALS KK
Reel/Frame 058550/0322 →
Change of Name Mar 21, 2022
From: NIHON CABOT MICROELECTRONICS K.K.
To: CMC MATERIALS KK
Reel/Frame 059452/0251 →
Assignment of Assignor's Interest Jun 10, 2022
From: KITAMURA, HIROSHI; NAMIKI, AKIHISA; MASUDA, TSUYOSHI; MATSUMURA, YOSHIYUKI
To: CMC MATERIALS KK
Reel/Frame 060161/0948 →
Security Interest Jul 8, 2022
From: CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 060615/0001 →
Assignment of Assignor's Interest Dec 4, 2023
From: ENTEGRIS JAPAN CO., LTD.
To: ENTEGRIS, INC.
Reel/Frame 065746/0789 →