IP Library Assignment 036793/0984
Patent Assignment
Reel/Frame 036793/0984

Assignment of Assignor's Interest

Recorded: 2015-10-14 Pages: 3
Assignors
KITAMURA, HIROSHI
Executed: 2015-10-13
MASUDA, TSUYOSHI
Executed: 2015-10-13
MATSUMURA, YOSHIYUKI
Executed: 2015-10-13
Assignee
NIHON CABOT MICROELECTRONICS K.K.
870 NORTH COMMONS DRIVE, AURORA, ILLINOIS, 60504
Covered Property (1)
Slurry Composition and Method of Substrate Polishing
Patent: 9,528,031 →
Application: 14/784,527 →
Publication: US 2016/0068713
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 21, 2022
From: NIHON CABOT MICROELECTRONICS K.K.
To: CMC MATERIALS KK
Reel/Frame 059452/0251 →
Security Interest Jul 8, 2022
From: CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 060615/0001 →
Merger Nov 28, 2023
From: CMC MATERIALS KK
To: ENTEGRIS JAPAN CO., LTD.
Reel/Frame 065686/0902 →
Assignment of Assignor's Interest Dec 4, 2023
From: ENTEGRIS JAPAN CO., LTD.
To: ENTEGRIS, INC.
Reel/Frame 065746/0789 →