Patent Assignment
Reel/Frame 036793/0984
Assignment of Assignor's Interest
Recorded: 2015-10-14
Pages: 3
Assignors
KITAMURA, HIROSHI
Executed: 2015-10-13
MASUDA, TSUYOSHI
Executed: 2015-10-13
MATSUMURA, YOSHIYUKI
Executed: 2015-10-13
Assignee
NIHON CABOT MICROELECTRONICS K.K.
870 NORTH COMMONS DRIVE, AURORA, ILLINOIS, 60504
Covered Property
(1)
Slurry Composition and Method of Substrate Polishing
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 21, 2022
From: NIHON CABOT MICROELECTRONICS K.K.
To: CMC MATERIALS KK
Reel/Frame 059452/0251 →
Security Interest
Jul 8, 2022
From: CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 060615/0001 →
Merger
Nov 28, 2023
From: CMC MATERIALS KK
To: ENTEGRIS JAPAN CO., LTD.
Reel/Frame 065686/0902 →
Assignment of Assignor's Interest
Dec 4, 2023
From: ENTEGRIS JAPAN CO., LTD.
To: ENTEGRIS, INC.
Reel/Frame 065746/0789 →