IP Library › Assignment 059452/0251
Patent Assignment
Reel/Frame 059452/0251

Change of Name

Recorded: 2022-03-21 Pages: 11
Assignor
NIHON CABOT MICROELECTRONICS K.K.
Executed: 2020-10-28
Assignee
CMC MATERIALS KK
1287-19 KITA-KOYAMA, GEINO-CHO, TSU-SHI, MIE, JAPAN
Covered Properties (2)
Slurry Composition and Method of Substrate Polishing
Patent: 9,528,031 →
Application: 14/784,527 →
Publication: US 2016/0068713
Slurry Composition and Method for Polishing Substrate
Patent: 9,914,853 →
Application: 15/126,543 →
Publication: US 2017/0037278
Related Assignments (5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 14, 2015
From: KITAMURA, HIROSHI; MASUDA, TSUYOSHI; MATSUMURA, YOSHIYUKI
To: NIHON CABOT MICROELECTRONICS K.K.
Reel/Frame 036793/0984 →
Assignment of Assignor's Interest Sep 15, 2016
From: KITAMURA, HIROSHI; MASUDA, TSUYOSHI; MATSUMURA, YOSHIYUKI
To: NIHON CABOT MICROELECTRONICS K.K.
Reel/Frame 039760/0222 →
Security Interest Jul 8, 2022
From: CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 060615/0001 →
Merger Nov 28, 2023
From: CMC MATERIALS KK
To: ENTEGRIS JAPAN CO., LTD.
Reel/Frame 065686/0902 →
Assignment of Assignor's Interest Dec 4, 2023
From: ENTEGRIS JAPAN CO., LTD.
To: ENTEGRIS, INC.
Reel/Frame 065746/0789 →