Patent Assignment
Reel/Frame 039760/0222
Assignment of Assignor's Interest
Recorded: 2016-09-15
Pages: 3
Assignors
KITAMURA, HIROSHI
Executed: 2016-08-15
MASUDA, TSUYOSHI
Executed: 2016-08-15
MATSUMURA, YOSHIYUKI
Executed: 2016-08-16
Assignee
NIHON CABOT MICROELECTRONICS K.K.
1287-19, KITAKOYAMA, GEINO-CHO, TSU-SHI, MIE, 5142213, JAPAN
Covered Property
(1)
Slurry Composition and Method for Polishing Substrate
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 21, 2022
From: NIHON CABOT MICROELECTRONICS K.K.
To: CMC MATERIALS KK
Reel/Frame 059452/0251 →
Security Interest
Jul 8, 2022
From: CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 060615/0001 →
Merger
Nov 28, 2023
From: CMC MATERIALS KK
To: ENTEGRIS JAPAN CO., LTD.
Reel/Frame 065686/0902 →
Assignment of Assignor's Interest
Dec 4, 2023
From: ENTEGRIS JAPAN CO., LTD.
To: ENTEGRIS, INC.
Reel/Frame 065746/0789 →