Patent Assignment
Reel/Frame 060162/0214
Assignment of Assignor's Interest
Recorded: 2022-06-10
Pages: 4
Assignor
KIM, HYUNSU
Executed: 2022-06-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and a Method of Manufacturing the Semiconductor Package