Patent Assignment
Reel/Frame 060202/0488
Assignment of Assignor's Interest
Recorded: 2022-05-26
Pages: 26
Assignors
DEGAI, MOTOMU
Executed: 2022-05-20
NAKATANI, KIMIHIKO
Executed: 2022-05-11
HASHIMOTO, YOSHITOMO
Executed: 2022-04-28
WASEDA, TAKAYUKI
Executed: 2022-05-20
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN
Covered Property
(1)
Method of Processing Substrate, Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium