Patent Assignment
Reel/Frame 060212/0574
Assignment of Assignor's Interest
Recorded: 2022-06-15
Pages: 7
Assignors
FOO, LOKE YIP
Executed: 2020-06-29
YEW, TEONG GUAN
Executed: 2020-06-29
CHEE, CHOONG KOOI
Executed: 2022-06-14
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Embedded Dual-Sided Interconnect Bridges for Integrated-Circuit Packages
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.