Patent Assignment
Reel/Frame 060218/0445
Assignment of Assignor's Interest
Recorded: 2022-05-30
Pages: 3
Assignee
SEMILEDS OPTOELECTRONICS CO., LTD.
3F, NO. 11, KE JUNG RD., CHU-NAN SITE,, HSINCHU SCIENCE PARK, CHU-NAN, MIAO-LI COUNTY, 350, TAIWAN
Covered Property
(1)
Method For Making Electronic Device Arrays Using A Temporary Substrate And A Carrier Substrate