Method for making electronic device arrays using a temporary substrate and a carrier substrate

1. A method for making electronic device arrays comprising:

providing a plurality of separate electronic devices;

providing a carrier substrate and a temporary substrate attached to the carrier substrate, the carrier substrate configured as a support substrate for supporting the electronic devices and the temporary substrate configured as an attaching substrate for attaching the electronic devices to the support substrate;

attaching the electronic devices to the temporary substrate;

forming one or more insulator layers on the electronic devices while attached to the temporary substrate;

forming one or more metal layers configured to electrically connect the electronic devices to form a desired circuitry; and

separating the electronic devices along with the metal layers and the insulator layers from the carrier substrate and the temporary substrate.

2. The method of claim 1 wherein the electronic devices comprise bare dice, packaged dice, or optical devices having a desired configuration.

3. The method of claim 1 wherein the forming of the metal layers step and the forming of the insulator layers step are performed in stages such that each completed electronic device array has a structural integrity configured to support the electronic devices.

4. The method of claim 1 wherein each completed electronic device array has at least two metal layers and at least two insulator layers.

5. The method of claim 1 wherein each completed electronic device array includes one or more vias configured to electrically connect the metal layers.

6. A method for making electronic device arrays comprising:

providing a plurality of separate electronic devices, each electronic device comprising a bare die, a packaged device or an optical device having a desired configuration;

providing a carrier substrate and a temporary substrate attached to the carrier substrate, the carrier substrate configured as a support substrate for supporting the electronic devices and the temporary substrate configured as an attaching substrate for attaching the electronic devices to the support substrate, wherein the temporary substrate and the carrier substrate are combined into one substrate;

attaching the electronic devices to the temporary substrate;

forming one or more insulator layers on the electronic devices attached to the temporary substrate;

forming one or more metal layers on the insulator layers configured to electrically connect the electronic devices to form a desired circuitry; and

separating the electronic devices along with the metal layers and the insulator layers from the carrier substrate and the temporary substrate.

7. The method of claim 6 wherein the electronic devices are physically connected by the one or more insulator layers.

8. The method of claim 6 wherein the electronic devices comprise at least one vertical LED and at least one planar LED.

9. The method of claim 6 wherein the electronic devices comprise at least one planar LED.

10. The method of claim 6 further comprising prior to the separating step planarizing at least one insulator layer.

11. The method of claim 6 further comprising prior to the separating step planarizing at least one metal layer.

12. A method for making electronic device arrays comprising:

providing a plurality of separate electronic devices, each electronic device having a desired configuration with extended pads;

providing a carrier substrate and a temporary substrate attached to the carrier substrate, the carrier substrate configured as a support substrate for supporting the electronic devices and the temporary substrate configured as an attaching substrate for attaching the electronic devices to the support substrate;

attaching the electronic devices to the temporary substrate;

forming a plurality of metal posts on the temporary substrate in electrical contact with the electronic devices and encapsulating the metal posts in an insulator layer; and

separating the electronic devices along with the metal posts and the insulator layer from the carrier substrate and the temporary substrate.

13. The method of claim 12 further comprising prior to the encapsulating the metal posts step, forming a plurality of electrical connectors in electrical contact with the metal posts and with pads on the electronic devices.

14. The method of claim 13 further comprising forming a common electrode in electrical communication with the electrical connectors.

15. The method of claim 14 wherein the common electrode comprises an anode or a cathode.

16. The method of claim 15 wherein the temporary substrate and the carrier substrate are combined into one substrate.