Patent Assignment
Reel/Frame 060219/0173
Assignment of Assignor's Interest
Recorded: 2022-06-16
Pages: 6
Assignors
PARK, JINYOUNG
Executed: 2022-05-23
PARK, SANGWUK
Executed: 2022-05-23
PARK, HYUN-CHUL
Executed: 2022-05-23
HONG, JUNGPYO
Executed: 2022-05-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Fabricating the Same
Application:
17/807,146 →
Publication:
US 2023/0094529
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.