Patent Assignment
Reel/Frame 060263/0096
Assignment of Assignor's Interest
Recorded: 2022-06-21
Pages: 3
Assignee
AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
1 YISHUN AVENUE 7, SINGAPORE, 768923, SINGAPORE
Covered Properties
(2)
Circuit Packages and Fabrication Methods Using Bond-on-Pad (Bop) Substrate Technology
Enable Bond-on-Pad Substrate Technology to Save Substrate Manufacturing Costs and Shorten Cycle Time
Application:
63/189,014 →