IP Library › Patent Application 63189014
Patent Application Provisional
App. No. 63/189,014 · Confirmation No. 3154

ENABLE BOND-ON-PAD SUBSTRATE TECHNOLOGY TO SAVE SUBSTRATE MANUFACTURING COSTS AND SHORTEN CYCLE TIME

Provisional Application Expired
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 Code Description Pages PDF
2021-05-21 APP.FILE.REC Filing Receipt 3 View
2021-05-14 DRW Drawings-only black and white line drawings 4 View
2021-05-14 APPENDIX Appendix to the specification 5 View
2021-05-14 ABST Abstract 1 View
2021-05-14 ADS Application Data Sheet 7 View
2021-05-14 WFEE Fee Worksheet (SB06) 2 View
2021-05-14 N417 Electronic Filing System Acknowledgment Receipt 3 View
2021-05-14 SPEC Specification 10 View
2021-05-14 CLM Claims 1 View
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Quick Facts
App. No.
63/189,014
Filed
2021-05-14