Patent Assignment
Reel/Frame 060263/0432
Assignment of Assignor's Interest
Recorded: 2022-06-21
Pages: 3
Assignors
HU, CHIH-CHIA
Executed: 2022-04-24
WANG, YU-HSIUNG
Executed: 2022-06-20
CHEN, MING-FA
Executed: 2022-04-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Forming Semiconductor Redistribution Structures