Patent Assignment
Reel/Frame 060267/0165
Assignment of Assignor's Interest
Recorded: 2022-06-21
Pages: 3
Assignee
NITTO DENKO CORPORATION
1-1-2, SHIMOHOZUMI, IBARAKI-SHI, OSAKA, 567-8680, JAPAN
Covered Property
(1)
Pressure-Sensitive Adhesive Sheet for Semiconductor Wafer Processing