Patent Assignment
Reel/Frame 060270/0666
Assignment of Assignor's Interest
Recorded: 2022-06-22
Pages: 14
Assignors
DAS SHARMA, DEBENDRA
Executed: 2022-06-16
CHOUDHARY, SWADESH
Executed: 2022-06-09
LANKA, NARASIMHA
Executed: 2022-06-15
WU, ZUOGUO
Executed: 2022-06-09
PASDAST, GERALD
Executed: 2022-06-08
SESHAN, LAKSHMIPRIYA
Executed: 2022-06-17
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Standard Interfaces for Die to Die (D2D) Interconnect Stacks