Patent Assignment
Reel/Frame 060270/0700
Assignment of Assignor's Interest
Recorded: 2022-06-22
Pages: 14
Assignors
CHOUDHARY, SWADESH
Executed: 2022-06-09
LANKA, NARASIMHA
Executed: 2022-06-15
DAS SHARMA, DEBENDRA
Executed: 2022-06-16
SESHAN, LAKSHMIPRIYA
Executed: 2022-06-06
WU, ZUOGUO
Executed: 2022-06-09
PASDAST, GERALD
Executed: 2022-06-08
Assignee
CORPORATION, INTEL
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Compliance and Debug Testing of a Die-to-Die Interconnect