IP Library › Assignment 060276/0727
Patent Assignment
Reel/Frame 060276/0727

Assignment of Assignor's Interest

Recorded: 2022-06-22 Pages: 3
Assignors
KUO, FENG-WEI
Executed: 2020-11-20
LIAO, WEN-SHIANG
Executed: 2020-11-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Manufacturing Method of Semiconductor Structure
Application: 17/846,596 →
Publication: US 2022/0320022