Patent Assignment
Reel/Frame 060277/0289
Assignment of Assignor's Interest
Recorded: 2022-06-22
Pages: 3
Assignor
LEE, CHING-LUN
Executed: 2020-03-17
Assignee
AMS AG
TOBELBADER STRASSE 30, PREMSTAETTEN, 8141, AUSTRIA
Covered Property
(1)
Semiconductor Device with a Bond Pad and a Sandwich Passivation Layer and Manufacturing Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.