Patent Assignment
Reel/Frame 060284/0807
Assignment of Assignor's Interest
Recorded: 2022-06-23
Pages: 8
Assignors
GEYIK, CEMIL
Executed: 2022-05-04
AYGUN, KEMAL
Executed: 2022-05-04
QIAN, ZHIGUO
Executed: 2022-05-08
DARMAWIKARTA, KRISTOF KUWAWI
Executed: 2022-05-09
ZHANG, ZHICHAO
Executed: 2022-05-04
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Packaging Architecture with Trench via Routing for on-Package High-Speed Interconnects
Application:
17/847,257 →
Publication:
US 2023/0420377
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.