Patent Assignment
Reel/Frame 076007/0292
Assignment of Assignor's Interest
Recorded: 2026-09-14
Pages: 4
Assignor
INTEL CORPORATION
Executed: 2026-04-10
Assignee
INTEL FOUNDRY IP LLC
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Properties
(24)
Integrated Circuit Supports with Microstrips
Application:
18/260,810 →
Publication:
US US20240088069A1
Microelectronic Assemblies Having Integrated Thin Film Capacitors
Silicon Nitride Liner for Promotion of Mold Adhesion in Integrated Circuits
Packaging Architecture with Patterned Through-Dielectric Vias and Redistribution Layers
Static Random-Access Memory Devices with Angled Transistors
Integrated Circuit (Ic) Device with Multilayer Metal Line
Packaging Architecture with Trench via Routing for on-Package High-Speed Interconnects
Application:
17/847,257 →
Publication:
US US20230420377A1
Integrated Circuit Packages with Silver and Silicon Nitride Multi-Layer
Application:
17/851,957 →
Publication:
US US20230420358A1
Package Architecture with Vertical Stacking of Integrated Circuit Dies Having Planarized Edges and Multi-Side Routing
Substrate Having One or More Electrical Interconnects
Modular Package Architecture for Voltage Regulator-Compute-Memory Circuits with Quasi-Monolithic Chip Layers
Application:
17/820,982 →
Publication:
US US20240063183A1
Package substrate with embedded dies in buildup layers
Application:
17/929,045 →
Publication:
US US20240079339A1
Hybrid Bonding with Photonic Integrated Circuits for High Bandwidth Reticle Stitching of Reticle Sized Integrated Circuit Dies
Enhanced Subtractive Etch Anisotropy Using Etch Rate Gradient
Package Substrate with Open Air Gap Structures
Application:
17/937,474 →
Publication:
US US20240113049A1
Photonic Integrated Circuit Packages Including Substrates with Glass Cores
Application:
18/058,996 →
Publication:
US US20240176069A1
Interconnect Device and Method
Application:
18/089,417 →
Publication:
US US20240213163A1
Integrated Circuit (Ic) Device with Hybrid Metal Layer
Application:
17/933,000 →
Publication:
US US20240096785A1
Thin Film Capacitors
Application:
17/948,586 →
Publication:
US US20240096561A1
Package Architecture with Memory Chips Having Different Process Regions
Nanoribbon Stacks Without Dielectric Protection Caps for Top Nanoribbons
Microelectronic Assemblies with Direct Bonding Using Nanotwinned Copper
Integrated Circuit Device with Reduced N-P Boundary Effect
Application:
18/187,801 →
Publication:
US US20240321887A1
Offset Interposers for Large-Bottom Packages and Large-Die Package-on- Package Structures
Related Assignments
(22)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 8, 2021
From: DARMAWIKARTA, KRISTOF KUWAWI; DUONG, BENJAMIN T.; PIETAMBARAM, SRINIVAS V.; SOUNART, THOMAS
To: INTEL CORPORATION
Reel/Frame 056473/0801 →
Assignment of Assignor's Interest
Sep 9, 2021
From: BRUN, XAVIER FRANCOIS; GAMBA, JASON M.; PIETAMBARAM, SRINIVAS V.
To: INTEL CORPORATION
Reel/Frame 057451/0660 →
Assignment of Assignor's Interest
Sep 30, 2021
From: GANESAN, SANKA; LAMBERT, WILLIAM J.; PENMECHA, BHARAT PRASAD; BRUN, XAVIER FRANCOIS
To: INTEL CORPORATION
Reel/Frame 057651/0327 →
Corrective Assignment to Correct the Conveying Party Data Names Previously Recorded at Reel: 057651 Frame: 0327. Assignor(S) Hereby Confirms the Assignment .
Oct 28, 2021
From: BRUN, XAVIER FRANCOIS; GAMBA, JASON M.; PIETAMBARAM, SRINIVAS V.
To: INTEL CORPORATION
Reel/Frame 057961/0130 →
Assignment of Assignor's Interest
Dec 10, 2021
From: ELSHERBINI, ADEL A.; PELTO, CHRISTOPHER M.; JUN, KIMIN; RAWLINGS, BRANDON M.
To: INTEL CORPORATION
Reel/Frame 058363/0660 →
Assignment of Assignor's Interest
Jun 23, 2022
From: GEYIK, CEMIL; AYGUN, KEMAL; QIAN, ZHIGUO; DARMAWIKARTA, KRISTOF KUWAWI
To: INTEL CORPORATION
Reel/Frame 060284/0807 →
Assignment of Assignor's Interest
Jun 28, 2022
From: GEYIK, CEMIL S; DARMAWIKARTA, KRISTOF KUWAWI; QIAN, ZHIGUO; AYGUN, KEMAL
To: GM CRUISE HOLDINGS LLC
Reel/Frame 060341/0065 →
Assignment of Assignor's Interest
Aug 19, 2022
From: ELSHERBINI, ADEL A.; RADHAKRISHNAN, KALADHAR; AUGUSTINE, ANNE; CHOI, BEOMSEOK
To: INTEL CORPORATION
Reel/Frame 061254/0694 →
Assignment of Assignor's Interest
Sep 16, 2022
From: CHOI, JUNE; WALLACE, CHARLES HENRY; SCHENKER, RICHARD E.; MEHTA, NIKHIL JASVANT
To: INTEL CORPORATION
Reel/Frame 061126/0110 →
Assignment of Assignor's Interest
Oct 3, 2022
From: DARMAWIKARTA, KRISTOF KUWAWI; GEYIK, CEMIL S.; AYGUN, KEMEL; IBRAHIM, TAREK A.
To: INTEL CORPORATION
Reel/Frame 061282/0784 →
Assignment of Assignor's Interest
Oct 4, 2022
From: ECTON, JEREMY; MAY, ROBERT ALAN; NAD, SUDDHASATTWA; PIETAMBARAM, SRINIVAS V.
To: INTEL CORPORATION
Reel/Frame 061305/0282 →
Assignment of Assignor's Interest
Oct 6, 2022
From: MARIN, BRANDON C.; DARMAWIKARTA, KRISTOF KUWAWI; PIETAMBARAM, SRINIVAS V.; DUAN, GANG
To: INTEL CORPORATION
Reel/Frame 061620/0753 →
Assignment of Assignor's Interest
Nov 28, 2022
From: LI, XIAOQIAN
To: INTEL CORPORATION
Reel/Frame 061889/0131 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 060341 Frame: 0065. Assignor(S) Hereby Confirms the Assignment.
Nov 30, 2022
From: GEYIK, CEMIL S.; DARMAWIKARTA, KRISTOF KUWAWI; QIAN, ZHIGUO; AYGUN, KEMAL
To: INTEL CORPORATION
Reel/Frame 062019/0594 →
Assignment of Assignor's Interest
Jan 13, 2023
From: MOHAMMADIGHALENI, MAHDI; DUONG, BENJAMIN; KAVIANI, SHAYAN; STACEY, JOSHUA
To: INTEL CORPORATION
Reel/Frame 062386/0539 →
Assignment of Assignor's Interest
Feb 2, 2023
From: KYU HAN, JUNG
To: INTEL CORPORATION
Reel/Frame 062569/0441 →
Assignment of Assignor's Interest
Mar 8, 2023
From: AHMED, SHAFAAT; KARPOV, ILYA V.; METZ, MATTHEW V.; DENARDIS, DARREN ANTHONY
To: INTEL CORPORATION
Reel/Frame 062918/0852 →
Assignment of Assignor's Interest
Apr 12, 2023
From: SUTHRAM, SAGAR; MAHAJAN, RAVINDRANATH VITHAL; MALLIK, DEBENDRA; KARHADE, OMKAR G.
To: INTEL CORPORATION
Reel/Frame 063295/0921 →
Assignment of Assignor's Interest
Apr 24, 2023
From: SUTHRAM, SAGAR; GOMES, WILFRED; ANANTHAKRISHNAN, NISHA; AYGUN, KEMAL
To: INTEL CORPORATION
Reel/Frame 063416/0875 →
Assignment of Assignor's Interest
May 5, 2023
From: SHARMA, ABHISHEK A.; SUTHRAM, SAGAR; PIERCE, KIMBERLY; TAN, ELLIOT
To: INTEL CORPORATION
Reel/Frame 063552/0016 →
Assignment of Assignor's Interest
May 18, 2023
From: SUTHRAM, SAGAR; MALLIK, DEBENDRA; HECK, JOHN; RANADE, PUSHKAR SHARAD
To: INTEL CORPORATION
Reel/Frame 063683/0514 →
Assignment of Assignor's Interest
Aug 7, 2023
From: NAD, SUDDHASATTWA; CHO, STEVE; WALL, MARCEL ARLAN; OZKAN, ONUR
To: INTEL CORPORATION
Reel/Frame 064509/0963 →