Patent Assignment
Reel/Frame 064509/0963
Assignment of Assignor's Interest
Recorded: 2023-08-07
Pages: 22
Assignors
NAD, SUDDHASATTWA
Executed: 2022-07-06
CHO, STEVE
Executed: 2022-07-07
WALL, MARCEL ARLAN
Executed: 2023-01-12
OZKAN, ONUR
Executed: 2022-08-17
LEHAF, ALI
Executed: 2022-08-19
YANG, YI
Executed: 2022-07-06
STEILL, JASON SCOTT
Executed: 2022-07-06
DUAN, GANG
Executed: 2022-07-06
MARIN, BRANDON C.
Executed: 2022-07-11
ECTON, JEREMY D.
Executed: 2022-07-06
PIETAMBARAM, SRINIVAS VENKATA RAMANUJA
Executed: 2022-07-06
HARIRI, HAIFA
Executed: 2023-08-02
NIE, BAI
Executed: 2022-07-06
TANAKA, HIROKI
Executed: 2022-07-25
MCELHINNY, KYLE
Executed: 2022-08-16
GAMBA, JASON
Executed: 2022-07-27
SARANAM, VENKATA RAJESH
Executed: 2023-03-09
DARMAWIKARTA, KRISTOF
Executed: 2022-08-22
CHEN, HAOBO
Executed: 2022-07-08
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Substrate Having One or More Electrical Interconnects
Application:
17/855,040 →
Publication:
US 2024/0006298
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.