Patent Assignment
Reel/Frame 063295/0921
Assignment of Assignor's Interest
Recorded: 2023-04-12
Pages: 13
Assignors
SUTHRAM, SAGAR
Executed: 2022-05-23
MAHAJAN, RAVINDRANATH VITHAL
Executed: 2022-05-26
MALLIK, DEBENDRA
Executed: 2022-06-08
KARHADE, OMKAR G.
Executed: 2022-05-25
GOMES, WILFRED
Executed: 2022-06-14
RANADE, PUSHKAR SHARAD
Executed: 2022-06-06
SHARMA, ABHISHEK A.
Executed: 2022-06-09
GHANI, TAHIR
Executed: 2022-07-15
MURTHY, ANAND S.
Executed: 2022-05-28
DESHPANDE, NITIN A.
Executed: 2022-08-06
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Package Architecture with Vertical Stacking of Integrated Circuit Dies Having Planarized Edges and Multi-Side Routing
Application:
17/846,109 →
Publication:
US 2023/0420436
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.