Patent Assignment
Reel/Frame 063683/0514
Assignment of Assignor's Interest
Recorded: 2023-05-18
Pages: 12
Assignors
SUTHRAM, SAGAR
Executed: 2022-06-24
MALLIK, DEBENDRA
Executed: 2022-06-24
HECK, JOHN
Executed: 2022-06-24
RANADE, PUSHKAR SHARAD
Executed: 2022-06-24
MAHAJAN, RAVINDRANATH VITHAL
Executed: 2022-06-26
LILJEBERG, THOMAS
Executed: 2022-06-27
GOMES, WILFRED
Executed: 2022-06-24
SHARMA, ABHISHEK A.
Executed: 2023-05-17
GHANI, TAHIR
Executed: 2022-07-16
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Hybrid Bonding with Photonic Integrated Circuits for High Bandwidth Reticle Stitching of Reticle Sized Integrated Circuit Dies
Application:
17/853,732 →
Publication:
US 2024/0004129
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.